Such as a site specialized in Linux Voronix We’ve now discovered that the first RDNA 3+ (3.5)-based GPUs have already found their way into the free Linux graphics package Mesa 3D in version 23.3. According to current information, the new graphics units based on the modified architecture will be used for the first time in the Zen 5 APUs of the upcoming “Strix Point” and “Strix Halo” processor families.
GFX1150 build also known as RDNA 3+ in Mesa 3D 23.3
source: Freedesktop via Voronix
In addition to Mesa 3D v23.3, the free Linux 6.7 kernel will also get initial support for the GFX1150 architecture known as RDNA 3+. The project page provides more details Feedesktop.org On the free developer platform Gitlab.
The Strix is expected to follow the Phoenix in 2024
The upcoming Zen 5 APUs from the AMD Ryzen 8000 (“Strix Point”) series, which will follow the Ryzen 7000 (“Phoenix”), will likely feature up to four large Zen 5 processor cores with up to eight cores combining Zen is particularly 5c efficient and thus offers a total of 12 cores and 24 threads. The latest information should also reveal clock frequencies, cache, and TDP.
Hybrid APUs with four times Zen 5 and eight times Zen 5c
The “Strix Point” series Ryzen 8000 APUs, which will likely only be listed as “Strix”, like just “Phoenix Point”, should have a cTDP as before with 35 to 54 watts (“H-Series”). ) or 15 to 30 watts (“U Series”) can be rated. Given the hybrid CPU architecture of the ‘next-gen APUs’, based on the more efficient ‘Zen 5’ and ‘Zen 5c’, a lower TDP rating is also conceivable. Screenshots of the so-called “engineering sample” have already confirmed the hybrid architecture to some extent. Information from All_WhatsApp However, it was not known before.
The new information is L2 and L3 cache as well as support for faster LPDDR5X memory up to 8,533 MT/s. As already expected, the cTDP should be set somewhat lower and range between 28 and 35W, even though we are most likely talking about the Ryzen 8000H. As before, the U series will be launched with a lower cTDP. The chip area, called “die size”, was first mentioned, which should be 225 mm². The Strix Point will roll off the assembly line at TSMC using the advanced N4P manufacturing process.
16x Zen 5 or 8x Zen 5 + 8x Zen 5c = Strix Halo
When it comes to the Ryzen 8000 (“Strix Halo”), which is said to be a true halo product for the APU sector, the rumors haven’t quite settled yet. The “Mega-APU” is not a direct successor to the AMD Ryzen 7045 (“Dragon Range”), but it is expected to position itself in a completely new way in the AMD APU portfolio. Such a CPU or APU simply did not exist until now. In particular, the 40 CU graphics unit will be a very unique and special selling point.
Strix Halo (“Sarlak”) and Strix Point (“Strix”) in numbers
The editorial team has already compiled all the information leaked so far into a table. However, these matters should still be treated with the utmost caution and classified as rumours. However, in the meantime, there are more and more sources that are gradually completing the picture. Strix Point, also known as Strix and Strix Halo, trading as Sarlak, is expected to be released in 2024.
Strix Halo* | Strix point* | |
---|---|---|
production | TSMC N4 | TSMC N4P |
building | Multi-chip modules | Homogenous |
CPU | Zen 5 + Zen 5C | Zen 5 + Zen 5C |
Up to 16C/32T | Up to 12C/24T | |
CPU configuration | 16x Zain5 or 8x Zain 5 + 8x Zain 5c |
4x Zain + 8x Zain 5c |
GPU | RNA 3.5 | RNA 3.5 |
Up to 40 CU | Up to 16 CU | |
Up to 2560 shades | Up to 1024 shades | |
L3 cache | 64 MB | 24 – 32 MB |
storage | 256-bit LPDDR5X And DDR5 |
128-bit LPDDR5X And DDR5 |
Artificial intelligence engine | XDNA | XDNA |
With up to 40 tops | With up to 20 tops | |
TPD | 55 to 120 watts | 28 to 45 watts And 15 to 30 watts |
*) Not officially confirmed yet!
In desktops, the Ryzen 8000 (“Granite Ridge”) and 8000X3D (“Granite Ridge-X”) should be followed by the Ryzen 7000 (“Raphael”) and 7000X3D (“Raphael-X”), especially for gamers who enjoy a more efficient and higher-end manufacturing process. IPC.
When it comes to the I/O die, at least in the desktop, everything should remain the same and a microchip should be used that has already been used for the Ryzen 7000 (“Raphael”) and Ryzen 7000X3D (“Raphael-X”).
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source: Freedesktop.org via Phoronix via Videocards
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